By Suryadevara Babu
Advances in Chemical Mechanical Planarization (CMP) provides the most recent details on a mainstream strategy that's serious for high-volume, high-yield semiconductor production, or even extra in order equipment dimensions proceed to reduce. The expertise has grown to surround the elimination and planarization of a number of steel and dielectric fabrics and layers either on the machine and the metallization degrees, utilizing assorted instruments and parameters, requiring advancements within the keep an eye on of topography and defects.
This vital booklet bargains a scientific evaluation of basics and advances within the zone. half One covers CMP of dielectric and steel motion pictures, with chapters targeting using specific recommendations and techniques, and on CMP of specific quite a few fabrics, together with extremely low-k fabrics and high-mobility channel fabrics, and finishing with a bankruptcy reviewing the environmental affects of CMP techniques.
Part addresses consumables and method keep watch over for better CMP, and contains chapters at the guidance and characterization of slurry, diamond disc pad conditioning, using FTIR spectroscopy for characterization of floor tactics, and ways for defection characterization, mitigation, and reduction.
- Considers concepts and strategies for CMP of dielectric and steel films
- Includes chapters dedicated to CMP for specific materials
- Addresses consumables and approach keep watch over for more suitable CMP
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Extra resources for Advances in Chemical Mechanical Planarization (CMP) (Woodhead Publishing Series in Electronic and Optical Materials)
Advances in Chemical Mechanical Planarization (CMP) (Woodhead Publishing Series in Electronic and Optical Materials) by Suryadevara Babu