By John H. Lau,Cheng Kuo Lee,C. S. Premachandran,Yu Aibin
A accomplished advisor to 3D MEMS packaging equipment and solutions
Written by way of specialists within the box, Advanced MEMS Packaging serves as a priceless reference for these confronted with the demanding situations created by means of the ever-increasing curiosity in MEMS units and packaging. This authoritative advisor offers state-of-the-art MEMS (microelectromechanical platforms) packaging thoughts, resembling low-temperature C2W and W2W bonding and 3D packaging.
This definitive source is helping you decide trustworthy, artistic, high-performance, strong, and in your price range packaging innovations for MEMS units. The e-book also will reduction in stimulating additional examine and improvement in electric, optical, mechanical, and thermal designs in addition to fabrics, procedures, production, checking out, and reliability. one of the issues explored:
- Advanced IC and MEMS packaging trends
- MEMS units, advertisement functions, and markets
- More than 360 MEMS packaging patents and 10 3D MEMS packaging designs
- TSV for 3D MEMS packaging
- MEMS wafer thinning, dicing, and handling
- Low-temperature C2C, C2W, and W2W bonding
- Reliability of RoHS-compliant MEMS packaging
- Micromachining and water bonding techniques
- Actuation mechanisms and built-in micromachining
- Bubble swap, optical swap, and VOA MEMS packaging
- Bolometer and accelerameter MEMS packaging
- Bio-MEMS and biosensor MEMS packaging
- RF MEMS switches, tunable circuits, and packaging
Read Online or Download Advanced MEMS Packaging PDF
Similar optical engineering books
The e-book is concentrated at the use of practical oxide and nitride skinny motion pictures to extend performance and alertness diversity of MEMS (microelectromechanical platforms) within the huge feel, together with micro-sensors, micro-actuators, and digital parts for top frequency communications. The booklet covers significant themes and is split into elements (a) functions and rising purposes, and (b) fabrics, fabrication applied sciences, and functioning concerns.
Whereas MEMS know-how has stepped forward speedily, commercialization of MEMS has been hindered by way of packaging expertise obstacles and prices. one of many key matters within the industrialization of MEMS, MOEM and finally Nanoelectrical units is the improvement of applicable packaging ideas for the security, meeting, and long-term trustworthy operation.
The Institute of Optics, college of Rochester * ". readers looking for a panoramic and up-date view of fibre optic conversation structures could do good to buy this e-book. "-International magazine of electric Engineering schooling (on the second one version) * This accomplished, updated account of fiber-optic verbal exchange specializes in the physics and know-how at the back of fiber-optic conversation structures whereas protecting either the structures and elements elements * presents wide information at the WDM expertise and method layout concerns that experience built because the final version * An Instructor's handbook proposing certain recommendations to all of the difficulties within the booklet is out there from the Wiley editorial division.
Present facts centre networks, in response to digital packet switches, are experiencing an exponential raise in community site visitors because of advancements reminiscent of cloud computing. Optical interconnects have emerged as a promising substitute providing excessive throughput and lowered energy intake. Optical Interconnects for information facilities stories key advancements within the use of optical interconnects in information centres and the present cutting-edge in reworking this expertise right into a truth.
- Materials Science of Thin Films
- Beam Effects, Surface Topography, and Depth Profiling in Surface Analysis (Methods of Surface Characterization)
- Femtosecond Laser Filamentation: 55 (Springer Series on Atomic, Optical, and Plasma Physics)
- Super-Resolved Imaging: Geometrical and Diffraction Approaches (SpringerBriefs in Physics)
- An Introduction to Hamiltonian Optics
Additional info for Advanced MEMS Packaging
Advanced MEMS Packaging by John H. Lau,Cheng Kuo Lee,C. S. Premachandran,Yu Aibin